Capabilities & Equipment

Engineering and Manufacturing Capabilities

Everything you need to take an electronic product from concept to shipment, managed from our facility in Pune, India. Equipment details below are a summary; ask us for a full capability sheet.

Engineering and Manufacturing Capabilities

Capability areas

01

Design engineering

Schematic, PCB layout, firmware and mechanical integration.

02

SMT assembly

Solder paste printing, component placement and reflow.

03

Through-hole assembly

Hand and selective soldering of THT components.

04

Inspection

Visual, magnified and optical inspection.

05

Rework

Fine-pitch and BGA rework stations.

06

Testing

Custom functional test jigs and burn-in.

07

Cable & harness

Cutting, crimping and continuity testing.

08

Box build

Enclosure integration and final assembly.

Capability summary (confirm with team)

Area
Range
Volumes
Prototype to repeat production
Assembly
SMT, THT, mixed, double-sided
Packages
Chip passives, QFN, QFP, BGA
Firmware
8/16/32-bit MCUs
Testing
Functional, ICT, burn-in
Coating
Conformal coating on request
On this page (10 sections)
  1. One facility, full flow
  2. Engineering tools
  3. Flexible volumes
  4. Request a capability sheet
  5. Design capabilities
  6. Manufacturing capabilities
  7. Testing capabilities
  8. Supply chain capabilities
  9. Industries served
  10. Plan a visit

One facility, full flow

Design, assembly, testing and integration take place under one roof, which shortens hand-offs and keeps accountability clear.

This approach reduces delays, keeps responsibility clear and makes it easier to resolve issues quickly.

Engineering tools

Our engineers use industry-standard tools for schematic capture, PCB layout, firmware development and debugging, along with measurement equipment such as oscilloscopes, power supplies and multimeters for bring-up and testing.

Our engineers use these tools daily to design, debug and verify products.

Flexible volumes

The same processes support prototypes, pilot batches and repeat production, so moving between stages does not introduce new variables.

You can start small and grow without changing suppliers or processes.

Request a capability sheet

For a detailed list of equipment, tolerances and supported technologies, contact us and we will share our current capability sheet.

The capability sheet is updated regularly as our equipment and processes evolve.

Design capabilities

Schematic capture, PCB layout from simple to multilayer, analog and mixed-signal design, power electronics, embedded firmware, enclosure integration and test fixture design.

These capabilities allow us to take products from concept to production-ready design.

Manufacturing capabilities

SMT and through-hole assembly, mixed technology and double-sided boards, rework, conformal coating, cable and harness assembly, box build, programming and packing.

Manufacturing processes are documented and controlled for consistent results.

Testing capabilities

Visual and optical inspection, in-circuit and functional testing, burn-in and test reporting.

Testing is tailored to each product's requirements and risks.

Supply chain capabilities

Turnkey, consigned and partial turnkey sourcing, BOM scrubbing, alternate part qualification, obsolete part sourcing and kitting.

Supply chain support keeps production running even when parts are scarce.

Industries served

Our capabilities support industrial automation, defence, medical, automotive and EV, consumer electronics and IoT customers.

Experience across industries brings ideas and best practices to every project.

Plan a visit

Customers are welcome to visit our facility to see our capabilities in person. Contact us to arrange a visit.

Visits help build trust and allow detailed discussions with our team.

Related

Ready to Build?

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